| Material | C6801 |
|---|---|
| Surface treatment | Tin plating |
| Dimensions (length * width * height)mm | Ø3.5*2.3 |
| packaging | loose/strapped |
Under the rapid growth of semiconductor packaging technology, there is a high demand for pitch size reduction, high heat dissipation, high conductivity, and high frequency. Copper pillars have gradually replaced solder balls as substitutes.
Xinweida Precision Electronics (Suzhou) Co., Ltd
Abremi Electronic Materials (Suzhou) Co., Ltd
Phone：0512-57288013
Mobile：18115531316
Mobile：18556963376
E-mail：info@suzhouxinweida.com
address：No. 1399, Yingbin Middle Road,
Chengbei High-Tech Zone, Kunshan City, Suzhou, Jiangsu, China
www.suzhouxinweida.com