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Product Introduction
Product Introduction
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Ø3.5*2.3 bronze pillar

0512-6607 4325

Material	C6801
Surface treatment	Tin plating
Size (LengthWidthHeight) mm	Ø3.5*2.3
Packaging	Bulk/Tape and Reel

Under the rapid development of semiconductor packaging technology, there is a high demand for pitch size reduction, high heat dissipation, high conductivity, and high frequency. Copper pillars have gradually replaced solder balls as the alternative.

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Ø3.5*2.3 bronze pillar

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