Material | SUS430F |
|---|---|
Surface treatment | Tin plating |
Size (LengthWidthHeight) mm | Ø6.3*8.7 |
Packaging | Bulk/Tape & Reel |
Under the rapid development of semiconductor packaging technology, there is a high demand for pitch size reduction, high heat dissipation, high conductivity, and high frequency. Copper pillars have gradually replaced solder balls as the alternative.
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Xinweida Precision Electronics (Suzhou) Co., Ltd
Abremi Electronic Materials (Suzhou) Co., Ltd
Phone：0512-57288013
Mobile：18115531316
Mobile：18556963376
E-mail：info@suzhouxinweida.com
address：No. 1399, Yingbin Middle Road,
Chengbei High-Tech Zone, Kunshan City, Suzhou, Jiangsu, China
www.suzhouxinweida.com